Diffusion of Cu, Fe and Si in L1<SUB>2</SUB>-Type Intermetallic Compound Ni<SUB>3</SUB>Al
نویسندگان
چکیده
منابع مشابه
Tribological Behaviour of Fe-Al Intermetallic Compound Coated Carbon Tool Steel
The use of Fe-Al intermetallic compound coatings has been investigated in order to improve the tribological behaviour of carbon tool steel. The coatings were formed by a pack cementation process and subsequently diffusion annealing at 900˚C in an argon controlled atmosphere. The optimum diffusion time was selected on the basis of optimum thickness and tribological behaviour. The microstructure...
متن کاملInvestigating the Joining of Ni3Al Intermetallic Compound, using Transient Liquid Phase (TLP) Method with Cu Interlayer
In this study, joining of Ni3Al intermetallic compounds using the transient liquid phase (TLP) process with Cu interlayer was investigated. The binding process was carried out in a vacuum furnace at a temperature of 1050 °C for different times of 30, 60, 90 and 120 minutes. The effect of time variation on microstructure and mechanical properties of the joint zone was investigated. The EDS analy...
متن کاملTribological Behaviour of Fe-Al Intermetallic Compound Coated Carbon Tool Steel
The use of Fe-Al intermetallic compound coatings has been investigated in order to improve the tribological behaviour of carbon tool steel. The coatings were formed by a pack cementation process and subsequently diffusion annealing at 900˚C in an argon controlled atmosphere. The optimum diffusion time was selected on the basis of optimum thickness and tribological behaviour.
The microstructu...
متن کامل: metadiscourse in introduction sections of applied linguistics and physics research articles: exploring variation in frequency and type
abstract in written mode of language, metadiscourse markers are used commonly to help writers in general and academic writers in particular to produce coherent and professional texts. the purpose of the present study was to compare introduction sections of applied linguistics and physics articles regarding their use of interactive and interactional metadiscourse markers based on the model pro...
15 صفحه اولCu-Sn Intermetallic Compound Growth in Hot-Air-Leveled Tinat and below 100°C - Tyco Electronics
Low-temperature intermetallic compound (lMC) growth in hot-air-leveled tin (HALT) at lower temperatures was investigated. A technique based on image analysis of backscatter electron scanning electron microscopy images was used to measure the average thickness of Cu-Sn IMC in HALT at 50°C, 75°C, and 100°C with a high degree of precision. The technique made it possible to observe new features of ...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of the Japan Institute of Metals and Materials
سال: 1994
ISSN: 0021-4876,1880-6880
DOI: 10.2320/jinstmet1952.58.4_397